H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/4
H05K 1/14 (2006.01)
Patent
CA 1090003
MULTILAYER CIRCUIT BOARD WITH INTEGRAL FLEXIBLE APPENDAGES ABSTRACT OF THE DISCLOSURE Novel method and apparatus for creating multilayer printed circuit boards having integral flexible conductor appendages, involving the utilization of an array of flexible, circuit-containing layers bonded in properly aligned rela- tionship between rigid layers equipped with suitable elec- trical connections. In accordance with this invention, all of the aforementioned layers are substantially larger than the size the finished circuit board is to be, thereby making possible, in accordance with this invention, the creation of integral, flexible appendages to the circuit board. The assemblage of layers if maintained in this over-sized condition throughout the procedure in which holes to be used for interconnections are drilled, and quite importantly, during the time these holes are being plated through with conductive material. Only after the plating procedure has been completed are the portions of the upper and lower rigid layers removed from locations above and below the appendage portions, thus allowing them to attain the desired, flexible condition. The important advantage gained by utilizing the rigid material on the appendage portions is that by maintaining such portions of the assemblage rigid during the plating procedure, undesirable work hardening of the flexible portions is avoided, without tools for restraining the flexible portions having been necessary. Subsequent removal of the rigid material was selectively withheld from certain portions of the assemblage at the time bonding was being accomplished, and the rigid material was slotted in pre-established locations.
278796
Martin Marietta Corporation
Robic Robic & Associes/associates
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