Multilayer circuit board with repaired i/o pin and process...

Details Multilayer circuit board with repaired i/o pin and process... Multilayer circuit board with repaired i/o pin and process...

H - Electricity

05

K

H05K 1/02 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 3/00 (2006.01) H05K 3/30 (2006.01) H05K 3/22 (2006.01)

Patent

CA 2080094

When an external connection I/O pin which is formed on a multilayer ceramic circuit board is broken off together with a part of a ceramic substrate, an electrically conductive adhesive is filled in the area where the I/O pin broke and was removed, and together with standing a new pin in this place and connecting it electrically, the new pin is bridged and secured to the surrounding I/O pins using a fixation plate. In so doing, it is possible to restore the broken I/O pin to have the same electrical and mechanical characteristics as before.

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