H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/288 (2006.01) H01L 21/48 (2006.01)
Patent
CA 2595402
A multilayer circuit includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by electroplating techniques. Substrates formed in this manner enable significant increases in circuit pattern miniaturization, circuit pattern reliability, interconnect density and significant reduction of over-all substrate thickness.
L'invention concerne un circuit multicouche comprenant un substrat de base diélectrique, des conducteurs formés sur le substrat de base et un film diélectrique mince déposé sous vide par-dessus les conducteurs et le substrat de base. Le film diélectrique mince déposé sous vide est imprimé au moyen de structures sacrificielles formées à l'aide de techniques de galvanisation. Les substrats ainsi formés permettent d'augmenter significativement la miniaturisation et la fiabilité des motifs de circuit, et la densité d'interconnexion et de réduire significativement l'épaisseur globale du substrat.
Pendo Shaun
Shah Rajiv
Medtronic Minimed Inc.
Oyen Wiggs Green & Mutala Llp
LandOfFree
Multilayer circuit devices and manufacturing methods using... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer circuit devices and manufacturing methods using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer circuit devices and manufacturing methods using... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1476244