Multilayer electrical interconnection device and method of...

C - Chemistry – Metallurgy – 23 – C

Patent

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C23C 4/12 (2006.01) C23C 4/02 (2006.01) H05K 1/05 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2240235

A method of bonding a thermally sprayed coating to a non-roughened aluminum substrate includes thermal spraying aluminum onto a fluxed and thermally activated aluminum substrate to provide a substrate capable of bonding to ceramic and metal multilayers.

Divulgation d'une méthode pour lier un revêtement appliqué par projection thermique sur un substrat d'aluminium non rugueux. Cette méthode comprend la projection thermique d'aluminium sur un substrat d'aluminium revêtu d'un flux et activé thermiquement, afin d'obtenir un substrat capable de se lier à des multicouches en céramique et en métal.

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