H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/02 (2006.01) B23K 35/36 (2006.01) H01B 1/22 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 1/14 (2006.01) H05K 3/40 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01) H05K 3/24 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2196024
Electronic assemblies comprising a sinterable composition are disclosed. The composition sinters reactively and/or non-reactively during the lamination cure cycle of the assembly. The composition generally comprises (i) at least one high melting particulate phase material, (ii) at least one low melting material, and (iii) an organic portion comprising a resin and a cross-linking agent.
Assemblages électroniques comprenant une composition frittable. La composition est frittable réactivement et (ou) non réactivement pendant le cycle de durcissement du laminage de l'assemblage. Elle comprend en général (i) au moins un matériau en phase particulaire à point de fusion élevé, (ii) au moins un matériau à point de fusion bas, et (iii) une partie organique comprenant une résine et un réticulant.
Allen Kathleen E.
Ernsberger Craig N.
Leach Sarah E.
Meyer Richard C.
Wenzel Ralph J.
Cts Corporation
Moffat & Co.
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