Multilayer interconnect system, and method of making

Details Multilayer interconnect system, and method of making Multilayer interconnect system, and method of making

H - Electricity

05

K

356/10

H05K 7/20 (2006.01) H01L 21/98 (2006.01) H01L 23/538 (2006.01) H01L 25/065 (2006.01)

Patent

CA 1073557

A MULTILAYER INTERCONNECT SYSTEM, AND METHOD OF MAKING ABSTRACT OF THE DISCLOSURE A large scale integrated circuit multilayer interconnect system in which signal propagation delay is substantially reduced by using air as the dielectric between layers, rather than an in- sulating material. The system is comprised of a plurality of two basic layers, namely a signal plane layer and a reference plane layer. The basic layers are spaced from and alternated with one another by insulated spacers to maintain a desired air gap.

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