Multilayer interconnects

Details Multilayer interconnects Multilayer interconnects

H - Electricity

05

K

356/17, 154/83,

H05K 1/03 (2006.01) B32B 15/08 (2006.01) H05K 3/46 (2006.01) H05K 1/09 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2022474

-17- EL-0278 ABSTRACT A multilayer interconnect comprising a ceramic substrate, a patterned conductor layer, a layer of acrylic or acrylate adhesive, an organic insulating film, and a metal foil layer. Active electrical components can be soldered onto the metal foil layer. These circuits are particularly useful in under the hood automotive applications.

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