Multilayer laminates

Details Multilayer laminates Multilayer laminates

B - Operations, Transporting

32

B

B32B 7/10 (2006.01) B21D 33/00 (2006.01) B32B 7/12 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2048321

K-18186/A/CGM 379 Multilayer laminates Abstract of the Disclosure Multilayer laminates comprising at least two metal foils which are bonded direct by a polymer layer of a polyamide-polyimide (PA-PI) block copolymer are suitable for making flexible electronic circuits.

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