Multilayer metalized composite on polymer film product and...

Details Multilayer metalized composite on polymer film product and... Multilayer metalized composite on polymer film product and...

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B32B 15/08 (2006.01) B05D 5/12 (2006.01) B32B 3/00 (2006.01) B32B 7/00 (2006.01) B32B 9/00 (2006.01) C23C 14/02 (2006.01) C23C 14/06 (2006.01) C23C 14/20 (2006.01) C23C 14/30 (2006.01) H05K 1/02 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2306786

A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.

L'invention concerne une matière de substrat composite utile pour la fabrication de circuits imprimés. Cette matière comporte un film polymère constitué d'au moins une surface modifiée par gravure au plasma, d'une première couche fine de nitrure métallique, d'une seconde couche fine de nitrure métallique et d'une troisième couche métallique électroconductrice.

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