Multilayer printed board

H - Electricity – 05 – K

Patent

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Details

H05K 1/03 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2395080

Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.

Carte à circuit imprimé et à plusieurs couches, destinée à être équipée de composants électroniques. Ladite carte comporte au moins une couche dont le comportement de dilatation thermique correspond à peu près au comportement de dilatation thermique des composants électroniques et détermine en même temps pour l'essentiel le comportement de dilatation thermique de la carte à circuit imprimé et à plusieurs couches.

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