H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/4
H05K 3/46 (2006.01)
Patent
CA 1312678
8567-55 ABSTRACT OF THE DISCLOSURE Apparatus and method for protecting intermediate layers of a multi-layer printed circuit board from chemical or other damage from processing of a layer or layers to which previously fabricated layers of the printed circuit board are attached prior to such additional processing. A thin layer of protective material is selectively attached to intermediate or inner layers of a multi-layer printed circuit board after fabrication of such layers, when the outer or subsequent layers are attached. Inner or intermediate layer(s) of a multi-layer printed circuit board are fabricated. When outer layer(s) of the resulting printed circuit board are attached to the inner or intermediate layer(s), a layer of protective material such as a thin sheet of chemical-resistive plastic is disposed between the inner or intermediate layer(s) and the outer layer(s) and is selectively or completely attached or bonded thereto such as with a layer of acrylic adhesive. The outer layer or layers can then be processed in the usual manner without adversely affecting or damaging the inner or intermediate layer or layers. Following such fabrication, if desired, the portion of the outer layer(s) to which a protective layer is attached, in areas where the protective layer is not attached to the inner or intermediate layer or layers, can be removed from the resulting multi-layer structure such as by routing or cutting the section desired to be removed.
553956
Dahlgren Victor F.
Gerrie Richard W.
Dahlgren Victor F.
Gerrie Richard W.
Interflex Corporation
Lockheed Sanders Inc.
Miraco Incorporated
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