Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

H - Electricity

05

K

356/15

H05K 3/46 (2006.01) B29B 15/08 (2006.01) B29C 70/08 (2006.01) H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2001480

ABSTRACT OF THE DISCLOSURE A multilayer printed circuit board comprising a laminate of at least one glass fiber nonwoven cloth layer impregnated with thermosetting resin and glass fiber woven cloth layers impregnated with thermosetting resin the laminate having a pair of V-cut grooves formed therein so that only glass fiber nonwoven cloth layer remains uncut whereby the multilayer printed circuit board can be divided at the uncut glass fiber nonwoven cloth layer along the V-cut grooves into a plurality of printed circuit board portions which can be mounted having a practical size 2 0

Affiliated with

Also associated with

Rating

Multilayer printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1906666