Multilayer printed circuit board and process for producing...

H - Electricity – 05 – K

Patent

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Details

H05K 3/46 (2006.01)

Patent

CA 2235819

A multilayer printed circuit board, characterized by being composed of an internal layer circuit board (1) coated with a light and heat curable undercoating agent (3), a copper foil (5) and an insulating adhesive (4) comprising as the main component a brominated bisphenol type epoxy resin or brominated phenoxy resin having a weight average molecular weight of at least 10,000, the copper foil (5) and the insulating adhesive (4) being laminated to one side or both sides of the internal layer circuit board (1) and being integrally cured with the internal layer circuit board (1) and the undercoating agent (3).

Plaquette de circuits imprimés multicouche, caractérisée par le fait qu'elle est constituée d'une plaquette de circuit de couche interne (1) revêtue d'un enduit intermédiaire léger et thermodurcissable (3), d'une feuille de cuivre (5) et d'un adhésif d'isolation (4) comprenant comme composant principal une résine époxy ou une résine phénoxy bromurée de type bisphénol bromuré, de poids moléculaire moyen d'au moins 10 000, la feuille de cuivre (5) et l'adhésif d'isolation (4) étant appliqués sur un côté ou sur les deux côtés de la plaquette de circuit de la couche interne (1) et étant durcis solidairement avec la plaquette de circuits de la couche interne (1) et l'enduit intermédiaire (3).

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