H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/6
H05K 1/00 (2006.01) H01C 17/065 (2006.01) H05K 1/14 (2006.01) H05K 1/16 (2006.01) H05K 3/46 (2006.01) H05K 1/09 (2006.01)
Patent
CA 2002001
ACD-1301 ABSTRACT A method is disclosed for manufacturing multilayer printed circuit boards in which one or more layers thereof, including intermediate layers, may include one or more screened on resistors. The method is particularly well suited for use where large numbers of resistors are required on one or more intermediate layers of a multilayer printed circuit board. The method includes the steps of manufacturing individual layers of the multilayer board with electrical circuits thereon and subsequently screening on one or more values of resistors using a polymer thick film resistive ink. Each layer of the multilayer board is cured to dry the polymer thick film resistors. The individual layers are thereafter bonded together into a multilayer board.
Litton Systems Inc.
Macrae & Co.
LandOfFree
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