Multilayer printed circuits and process for their fabrication

Details Multilayer printed circuits and process for their fabrication Multilayer printed circuits and process for their fabrication

H - Electricity

01

L

H01L 23/532 (2006.01) H05K 3/24 (2006.01) H05K 3/38 (2006.01) H05K 3/10 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2042739

ABSTRACT OF THE DISCLOSURE Multilayer printed circuits, and methods for their fabrication, are provided, characterized in that the conductive circuitry of the circuitry innerlayers is built up from electroless copper, and the surfaces of the electroless copper which confront the sandwiching pre-preg resin layers are provided with a tin coating to promote adhesion of the electroless copper to the pre-preg resin layers. The invention is particularly suitable for preparing multilayer circuits having buried through-holes.

Affiliated with

Also associated with

Rating

Multilayer printed circuits and process for their fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed circuits and process for their fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed circuits and process for their fabrication will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1784033