Multilayer thin film electrical devices free of adhesive

Details Multilayer thin film electrical devices free of adhesive Multilayer thin film electrical devices free of adhesive

B - Operations, Transporting

32

B

334/8, 154/92.1,

B32B 15/08 (2006.01) H01G 13/00 (2006.01) H01L 41/083 (2006.01) H01L 41/18 (2006.01) H01L 41/26 (2006.01)

Patent

CA 1263078

-0- MULTILAYER THIN FILM ELECTRICAL DEVICES FREE OF ADHESIVE Abstract There is disclosed a laminate comprising alternating polymer sheets and metal layers between the polymer sheets, the laminate being substantially free of adhesive. Each polymer sheet of the laminate has a thickness not exceeding about 25 µm, and the resistivity of the metal layer is from 1 to about 4 ohms/square. Such laminates are useful in making capacitors and piezoelectric multimorphs. A method of making such laminates is also disclosed, wherein a plurality of metal-coated polymer sheets are compressed, in the absence of an adhesive, under pressure sufficient to reduce the thickness of each of the polymeric film layers to a value that is no larger than about 25 µm.

489076

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