Multilayered leadframe with interdigitated leads

Details Multilayered leadframe with interdigitated leads Multilayered leadframe with interdigitated leads

H - Electricity

01

L

356/146

H01L 23/495 (2006.01) H01L 21/60 (2006.01)

Patent

CA 2027070

MULTILAYERED LEADFRAME WITH INTERDIGITATED LEADS ABSTRACT OF THE DISCLOSURE A leadframe for accomplishing electrical connection to an electronic device is formed of two or more segments, each having a set of leads extending therefrom. The segments are assembled so that the leads of one set are interdigitated with the leads of the other set along the length of the leads. The effective lead spacing of the leadframe is therefore less than that for any of the segments. The approach is particularly useful for stamped leadframe segments, because a minimum lead spacing for any segment is determined by the stamping operation.

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