B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 33/68 (2006.01) B29C 33/02 (2006.01) B29C 33/08 (2006.01) B29C 33/56 (2006.01) B29C 45/37 (2006.01) B29C 45/73 (2006.01) B29C 33/38 (2006.01) B29C 35/08 (2006.01)
Patent
CA 2062007
RD-19,297 MULTILAYERED MOLD STRUCTURE FOR HOT SURFACE MOLDING IN A SHORT CYCLE TIME Abstract of the Disclosure A multilayered insulated mold structure is provided. An insulation layer provided on each of the mold core retains heat at the molding surface, thereby increasing surface quality of the finished part. The insulating layer has a varying density across its thickness so as to have a low density center region and high density surface regions. By having a relatively low density, the center region of the insulating layer has a low thermal conductivety. Thus, the insulating layer may be made from the same material as the core and still have an acceptable insulating value. The use of the same material for adjacent layers reduces the potential of delamination of the layers. The multilayered mold is compatible with passage or active heating of the molding surface.
Company General Electric
Craig Wilson And Company
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