Multilayered polymeric structure

B - Operations – Transporting – 32 – B

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B32B 5/16 (2006.01) B32B 7/02 (2006.01) B32B 27/20 (2006.01) B65D 85/00 (2006.01) B65D 85/86 (2006.01) H01B 1/18 (2006.01) H01B 1/24 (2006.01)

Patent

CA 2411358

A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process for making a multilayered polymeric structure for packaging electronic components is also provided. The multilayered polymeric material is used to form trays and packages for containing electrical components.

L'invention concerne une structure polymère multicouche composée d'au moins deux couches polymères, chaque couche étant constituée d'un mélange d'une composition polymère et de fibrilles de carbone. Ladite structure polymère multicouche peut comporter un matériau électriquement conducteur entre la première et la seconde couche polymères. L'invention concerne également un procédé de fabrication d'une structure polymère multicouche destinée au conditionnement des composants électroniques. Le matériau polymère multicouche selon l'invention sert à former des plateaux et des emballages pour composants électriques.

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