G - Physics – 03 – F
Patent
G - Physics
03
F
96/254
G03F 7/20 (2006.01)
Patent
CA 1272062
Title MULTILEVEL IMAGING OF PHOTOPOLYMER RELIEF LAYER FOR THE PREPARATION OF CASTING MOLDS Abstract of the Invention Process for photofabricating master relief patterns from photohardenable layers, e.g., 0.01 to 0.5 inch (0.25 to 12.7 mm in thickness) which comprises: (1) exposing the layer through the back surface to first imagewise modulated actinic radiation for time to render layer insoluble to first preselected depth which when measured from back surface is less than layer thickness. (2) exposing overall to actinic radiation through back to render layer insoluble to second preselected depth which when measure from back surface is less than first preselected depth. (3) exposing imagewise through front surface to actinic radiation for a time sufficient to render exposed areas of layer insoluble to depth extending from front surface to at least second preselected depth, and (4) solvent removing soluble areas of layer. The master relief pattern is useful in making casting molds.
504597
E.i. Du Pont de Nemours And Company
Mccallum Brooks & Co.
LandOfFree
Multilevel imaging of photopolymer relief layer for the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilevel imaging of photopolymer relief layer for the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilevel imaging of photopolymer relief layer for the... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1285213