Multimodulus pressure sensor

Details Multimodulus pressure sensor Multimodulus pressure sensor

G - Physics

01

L

73/4

G01L 1/04 (2006.01) G01L 9/00 (2006.01) G02B 26/00 (2006.01)

Patent

CA 2005801

MULTIMODULUS PRESSURE SENSOR ABSTRACT OF THE DISCLOSURE A pressure sensor utilizes the effect of different elastic moduli between layers or sections of different material that are bonded together to form a body, so that when the bonded material unit is subjected to a uniform hydrostatic external pressure, the differences in the elastic moduli of each of the materials will cause the materials to deflect in a predictable manner proportional to pressure. The amount of warpage or deflection of the body of material can be measured as a function of pressure. Specifically, two layers of materials, such as silicon and borosilicate glass, which have substantially different elastic moduli can be bonded across an interface surface to form an assembly, and when subjected to a substantially uniform pressure on the exterior surfaces the assembly will deflect for indicating applied pressure at relatively high pressure ranges. The bonded material assembly is placed in a fluid to provide a substantially uniform applied hydrostatic pressure on all exposed surfaces of the bonded material assembly.

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