Multiple blank for electronic components, in particular...

Details Multiple blank for electronic components, in particular... Multiple blank for electronic components, in particular...

H - Electricity

05

K

H05K 1/02 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 3/18 (2006.01) H05K 3/24 (2006.01) H05K 3/40 (2006.01) H05K 3/42 (2006.01) H03H 3/00 (2006.01) H05K 3/00 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2332891

The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3), especially acoustic surface wave components. Each of these electronic components is suitable for contacting chips on the individual printed panels (2) using the flip-chip technique and for contacting the individual printed panels (2) with external connections using SMD technology. The inventive multiple printed panel (1) has metal-plated surfaces (5) for each individual printed panel (2), said metal-plated surfaces being located on a network which is integrated in the multiple printed panel and leads to a terminal pole (8). The bumps (13) are formed by galvanically separating metal onto the metal-plated surfaces (5).

L'invention concerne un flan imprimé multiple (1) pouvant être individualisé en flans imprimés individuels (2) pour des composants électroniques (3), notamment des composants à ondes de surface acoustiques, qui sont adaptés pour la mise en contact de puces par connexion par billes sur les flans imprimés individuels (2) et pour la mise en contact des flans imprimés individuels (2) selon la technique du montage en surface avec des connexions extérieures. Dans ce flan imprimé multiple (1), chaque flan imprimé individuel (2) présente des surfaces métallisées (5) qui se trouvent sur un système de réseau intégré dans le flan imprimé multiple et mènent à un pôle de connexion (8). La réalisation de bosses (13) s'effectue par dépôt par voie galvanique de métal sur les surfaces métallisées (5).

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