Multiple curable composition and use thereof

Details Multiple curable composition and use thereof Multiple curable composition and use thereof

C - Chemistry, Metallurgy

08

G

C08G 18/04 (2006.01) C08F 220/36 (2006.01) C08F 290/06 (2006.01) C08G 18/30 (2006.01) C08G 18/72 (2006.01) C08L 33/14 (2006.01) C08L 75/04 (2006.01) C09D 4/00 (2006.01) C09D 5/32 (2006.01) G03F 7/26 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2118679

A multiple curable composition is prepared from components consisting essentially of (a) an isocyanate adduct haling (i) free isocyanate groups and (ii) free photopolymerizable ethylenically unsaturated groups, wherein the ethylenically unsaturated groups comprise in the range of to 70 % of the total of any free functional groups on said adduct; (b) reactive (meth)acrylate diluents; (c) optionally, photoinitiator and, (d) an organic peroxide. When cured, the above composition is particularly suitable as a conformal coating on electronic circuit boards.

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