Multiple diamond layer polycrystalline diamond composite...

Details Multiple diamond layer polycrystalline diamond composite... Multiple diamond layer polycrystalline diamond composite...

B - Operations, Transporting

23

B

B23B 27/20 (2006.01) B23P 15/28 (2006.01) E21B 10/56 (2006.01)

Patent

CA 2183932

An improved polycrystalline diamond composite ("PDC") cutter with at least a secondary PDC cutting surface in addition to a primary PDC cutting surface and a method for making the same, wherein the cutter consists of at least one wafer of cemented tungsten carbide. The secondary cutting surfaces are formed by compacting and sintering diamond on grooves formed at the surface of a wafer forming the cutter body. When more than one wafer is used, the wafers are bonded to form the cutter body. Different grades of diamond may be compacted and sintered in different grooves.

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