Multiple integrated circuit interconnection arrangement

Details Multiple integrated circuit interconnection arrangement Multiple integrated circuit interconnection arrangement

H - Electricity

01

L

356/134

H01L 23/52 (2006.01) H01L 23/538 (2006.01) H05K 1/00 (2006.01) H05K 1/18 (2006.01)

Patent

CA 1311856

ABSTRACT A flexible chip interconnection means includes a flexible film having interconnection lines formed on opposite sides thereof, with selected of the interconnection lines from one side connected by through-film conductors to interconnection lines on the other side. Insulating layers cover both sets of lines on the other side. Insulating layers cover both sets of interconnection lines. Multi-chip circuits can be formed on the film with the interconnection lines directly connecting the chips.

536044

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