Multiple lamination high density interconnect process and...

Details Multiple lamination high density interconnect process and... Multiple lamination high density interconnect process and...

H - Electricity

05

K

H05K 3/46 (2006.01) H05K 1/11 (2006.01) H05K 3/36 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2049272

A high density interconnect structure incorporating a plurality of laminated dielectric layers is fabricated using a SPI/epoxy crosslinking copolymer blend adhesive in order to maintain the stability of the already fabricated structure during the addition of the later laminations while also maintaining the repairability of the high density interconnect structure.

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