Multiple lamination high density interconnect process and...

Details Multiple lamination high density interconnect process and... Multiple lamination high density interconnect process and...

H - Electricity

05

K

H05K 3/46 (2006.01)

Patent

CA 2049384

RD-18,938 MULTIPLE LAMINATION HIGH DENSITY INTERCONNECT PROCESS AND STRUCTURE EMPLOYING THERMOPLASTIC ADHESIVE HAVING SEQUENTIALLY DECREASING Tg's ABSTRACT OF THE DISCLOSURE A high density interconnect structure incorporating a plurality of laminated dielectric layers is fabricated using thermoplastic adhesive layers of progressively lower glass transition temperature in order to maintain the stability of the already fabricated structure during the addition of the later laminations. This structure also facilitates the removal of only a portion of the high density interconnect structure where a fault in the system can be corrected in one of the upper layers of the high density interconnect structure.

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