Multiple-layer microstrip assembly with inter-layer connections

Details Multiple-layer microstrip assembly with inter-layer connections Multiple-layer microstrip assembly with inter-layer connections

Category

H - Electricity

Subcategory

01

Subsubcategory

P

IPC codes

H01P 5/00 (2006.01) H01P 3/08 (2006.01) H01P 11/00 (2006.01)

Type

Patent

Patent number

CA 2109133

Description

ABSTRACT A multiple-layer microstrip assembly having an inter- layer connection for transitioning electrical signals between analogous surfaces of separate layers, comprising a plurality of layers, each having a top surface and a bottom surface; first top circuitry disposed on the first top surface of a first layer; first bottom circuitry disposed on the first bottom surface of the first layer; connecting means for electrically connecting the first top circuitry to the first bottom circuitry; second top circuitry disposed on the second top surface of a second layer; and binding means to hold the two layers together, wherein the first bottom circuitry is sufficiently adjacent and overlapping the second top circuitry to form an electrical connection therebetween, thereby forming a signal transition between the first top surface of the first layer and the second top surface of the second layer.

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