Multiple layer printed circuit boards and method of manufacture

Details Multiple layer printed circuit boards and method of manufacture Multiple layer printed circuit boards and method of manufacture

H - Electricity

05

K

H05K 1/02 (2006.01) H05K 3/46 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2169547

A printed circuit board (10) and method of manufacture thereof is disclosed. The printed circuit board (10) includes a first substrate provided from a conductive layer (12) having disposed on a first surface (12a) thereof a cured adhesive layer (14). A semi-cured adhesive layer (16) is then disposed over the cured adhesive layer (14) and a second substrate (18) is disposed against the semi-cured adhesive layer (16).

Carte à circuits imprimés (10) et son procédé de fabrication. La carte à circuits imprimés (10) comprend un premier substrat composé d'une couche conductrice (12) dont une première face (12a) porte une couche adhésive durcie (14). On forme sur la couche adhésive durcie (14) une couche adhésive partiellement durcie (16) et on place un second substrat (18) sur ladite couche adhésive partiellement durcie (16).

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