C - Chemistry – Metallurgy – 23 – G
Patent
C - Chemistry, Metallurgy
23
G
C23G 5/02 (2006.01) C11D 7/50 (2006.01) C11D 7/24 (2006.01) C11D 7/28 (2006.01) H05K 3/26 (2006.01)
Patent
CA 2163351
A non-aqueous cleaning process uses a organic solvent for removing soil or surface contamination from contaminated articles such as printed circuit boards which are cleaned by immersion into a sump compartment of a cleaning tank containing the organic cleaning solvent. The organic solvent is preferably a hydrocarbon solvent. The cleaned articles, now coated with the organic cleaning solvent, are then disposed in a rinsing sump containing a fluorocarbon based rinsing solvent having an affinity for the organic cleaning solvent. The organic solvent is thus removed from the articles which are then dried without waste water as in a conventional solvent vapor degreasing solvent process.
Un procédé de nettoyage non aqueux consiste à utiliser un solvant organique pour enlever des salissures ou toute substance contaminante superficielle d'articles contaminés tels que des plaquettes de circuits imprimés qui sont nettoyées par immersion dans un compartiment en forme de puits d'un réservoir de nettoyage contenant le solvant organique. Ce dernier est de préférence un solvant à base d'hydrocarbure. Les articles nettoyés et recouverts du solvant organique, sont ensuite disposés dans un puits de rinçage contenant un solvant de rinçage à base de fluorocarbone présentant une affinité par rapport au solvant nettoyant organique. Ce dernier est ainsi enlevé des articles, lesquels sont séchés sans eau résiduelle comme c'est le cas dans les procédés de dégraissage par vapeur de solvant classiques.
Basu Rajat Subhra
Harnish Daniel Franklin
Ingham Hepburn
Logsdon Peter Brian
Nalewajek David
Alliedsignal Inc.
Gowling Lafleur Henderson Llp
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