Multipurpose socket

H - Electricity – 01 – L

Patent

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Details

356/117, 324/58.

H01L 23/50 (2006.01)

Patent

CA 1289681

Abstract of the Disclosure A test socket for testing chips and chips on tape wherein the test socket is formed on a heat resistant dielectric film having contact pads and connector pads joined by metallic circuit traces and which film is wrapped on a compliant pad. The connector end of the tape is joined to a circuit board by a conductive tape and maintained in contact by the compliant pad. A frame registers the chip with the contact area of the tape.

577091

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