Mushroom casing composition and process

Details Mushroom casing composition and process Mushroom casing composition and process

C - Chemistry, Metallurgy

09

K

71/53, 195/58

C09K 17/00 (2006.01) A01G 1/04 (2006.01)

Patent

CA 1164234

ABSTRACT OF TEE DISCLOSURE In the cultivation of mushrooms from an underlying bed containing mushroom spores, novel compositions and pro- cesses are provided for a casing layer which is placed over the compost layer containing spawning mycelium. A hydro- philic, thermosetting prepolymer resin is mixed in with a casing substrate, preferably Canadian peat, other optional additives and sufficient amount of water to form a slurry, and the mixture is allowed to cure to a spongy block. The cured material is then pulverized and deposited as a casing layer over the compost layer. Because of the high water retention qualities of this material, watering the mushroom beds is reduced by a factor of three or More, thereby reducing operation and production costs, as also the incidence and severity of disease and displeasing blemishes.

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