C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/00 (2006.01) C01B 33/14 (2006.01) H01L 23/29 (2006.01)
Patent
CA 2537634
A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica having a particle size in a range between about 2 nanometers and about 20 nanometers, and optional reagents wherein the organofunctionalized colloidal silica substantially increases the glass transition temperature of the epoxy formulation. Further embodiments of the present invention include a semiconductor package comprising the aforementioned curable epoxy formulation.
La présente invention concerne un préparation époxy durcissable. Cette préparation comprend un monomère époxy, une silice colloïdale organo-fonctionnalisée dont la taille des particules se situe entre 2 et 20 nanomètres environ, et éventuellement des réactifs. La présence de silice colloïdale organo-fonctionnalisée a pour effet d'augmenter sensiblement la température de transition vitreuse de la préparation époxy. Dans d'autres modes de réalisation, l'invention concerne des ensembles semi-conducteurs renfermant la composition époxy durcissable susmentionnée.
Campbell John Robert
Prabhakumar Ananth
Rubinsztajn Slawomir
Schattenmann Florian Johannes
Tonapi Sandeep Shrikant
Company General Electric
Craig Wilson And Company
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