Natural aluminosilicate composites and aggregates...

C - Chemistry – Metallurgy – 04 – B

Patent

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C04B 14/00 (2006.01) C04B 16/00 (2006.01) C04B 18/00 (2006.01) C04B 20/04 (2006.01)

Patent

CA 2609220

The present invention is a direct reactive process of inorganic polymerization used to obtain composites whose polymeric matrix does not require chemical or thermal pre-activation of the mixture reactors of specific natural aluminosilicates and varied aggregates, in the manufacture of alternatives to ceramics, Portland cement, timber, gypsum and metallic frames, through an adequate mixture added to the inorganic matrix of one or more natural aggregates (silica, limestone, hydrated lime, vermiculite, asbestos fibers) combined or not with synthetic alkaline-resistant aggregates (tire rubber, polypropylene fibers, nylon, PVA). To these, an alkaline solution of water and sodium hydroxide and/or potassium hydroxide will be added for the molding or extrusion and cutting out of artifacts, which will be oven-dried and polymerized at temperatures between 100~C and 500~C.

L'invention concerne un procédé réactif direct de polymérisation inorganique utilisé de manière à obtenir des composites dont la matrice polymère ne nécessite pas de préactivation chimique ou thermique des réacteurs du mélange d'aluminosilicates naturels spécifiques et de divers agrégats dans la fabrication de produits alternatifs à la céramique, au ciment Portland, au bois d'oeuvre, au gypse et aux cadres métalliques, au moyen d'un mélange adéquat ajouté dans la matrice inorganique d'un ou de plusieurs agrégats naturels (silice, calcaire, chaux hydratée, vermiculite, fibres d'amiante) combinés ou non avec des agrégats synthétiques alcalino-résistants (caoutchouc de pneu, fibres de polypropylène, nylon, PVA). Une solution alcaline d'eau et d'hydroxyde de sodium et/ou d'hydroxyde de potassium est ajoutée dans ceux-ci, aux fins de moulage ou extrusion et de découpe d'artefacts qui seront séchés au four et polymérisés à des températures comprises entre 100 °C et 500 °C.

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