Near infrared-cutting material and process for production...

Details Near infrared-cutting material and process for production... Near infrared-cutting material and process for production...

G - Physics

02

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G02B 5/22 (2006.01) C08K 5/00 (2006.01) C08K 5/29 (2006.01) C08K 5/32 (2006.01) G02B 5/20 (2006.01) G02F 1/1335 (2006.01) H01J 17/49 (2006.01)

Patent

CA 2376743

A near infrared-cutting material produced by forming, on a transparent substrate, a transparent resin film containing at least a near infrared absorbing-dye and a dye having a maximum absorption wavelength at 550 to 620 nm, wherein the amount of the solvent remaining in the transparent resin film is 5 ppm by weight to less than 500 ppm by weight; since the amount of the solvent remaining in the transparent resin film containing a near infrared-absorbing dye, etc. is minimized, the long-term stability of the near infrared-absorbing dye, etc. in the film at high temperatures is greatly improved.

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