H - Electricity – 05 – K
Patent
H - Electricity
05
K
339/93
H05K 3/36 (2006.01)
Patent
CA 1293783
Abstract A printhead for a thermal ink jet printer of the like is brought into good electrical contact with raised electrical contacts on a flexible interconnect circuit by the use of a molded near-linear spring connect structure. This novel structure includes a horizontal central locating member form which a plurality of resilient hollow cylinders extend vertically upward and in alignment with the electri- cal contacts on the flexible interconnect circuit. Since there is a near-linear deflection of the cylinder walls with increasing force applied thereto, good electrical contact is achieved between the printhead and the flex circuit using a minimum of force, thereby minimizing the likelihood of damage to the printhead.
532524
Hewlett-Packard Company
Sim & Mcburney
LandOfFree
Near-linear spring connect structure for flexible... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Near-linear spring connect structure for flexible..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Near-linear spring connect structure for flexible... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1309896