Negative photoresist composition

Details Negative photoresist composition Negative photoresist composition

G - Physics

03

F

G03F 7/038 (2006.01) G03F 7/004 (2006.01)

Patent

CA 2100516

ABSTRACT OF THE DISCLOSURE A negative photoresist composition comprising an alkali-soluble resin containing a mixture of Resin A obtainable through a copolymerization of p-hydroxy- styrene and styrene and Resin B obtainable through a hydrogenation of poly(p-hydroxystyrene), a photo-induced acid precursor and a crosslinking agent. This negative photoresist composition is suitable for use in far ultraviolet (particularly KrF excimer laser) litho- graphy, excellent in various properties such as resolu- tion, sensitivity, film thickness retention, profile, heat resistance, etc., and small in standing wave.

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