Nickel coated copper as electrodes for embedded passive devices

Details Nickel coated copper as electrodes for embedded passive devices Nickel coated copper as electrodes for embedded passive devices

H - Electricity

05

K

H05K 1/16 (2006.01) C25D 1/04 (2006.01) C25D 5/16 (2006.01) H01C 1/14 (2006.01) H01C 7/00 (2006.01) H05K 1/09 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2462849

The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passibe circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.

Cette invention concerne la fabrication d'électrodes en feuilles métalliques servant à la fabrication de cartes de circuits imprimés comportant des composants de circuit passifs tels que des condensateurs, des résistances ou des bobines d'induction conçus dans une orientation plane. Une feuille de cuivre est appliquée sur chacune des surfaces opposées, lesquelles sont ensuite revêtues d'une fine couche de nickel, ce qui accroît la portée de fonctionnalité de la feuille.

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