Nickel coated copper powder and process for producing the same

Details Nickel coated copper powder and process for producing the same Nickel coated copper powder and process for producing the same

B - Operations, Transporting

22

F

B22F 1/02 (2006.01) B22F 1/00 (2006.01) C23C 18/18 (2006.01) C23C 18/34 (2006.01) H01B 1/22 (2006.01) H01B 5/00 (2006.01)

Patent

CA 2574173

An antioxidant nickel coated copper powder for conductive paste capable of forming conductive wiring parts for electronic circuits; and a process for producing the same. In particular, use is made of a nickel coated copper powder characterized by comprising a nickel coated copper powder produced by providing a copper powder as a core material, fixing a plating catalyst on the surface of copper powder through reduction reaction and applying electroless nickel plating to the outermost surface thereof. The reduction reaction is characterized in that hydrazine is used as a reducing agent.

L~invention porte sur une poudre de cuivre antioxydante, revêtue de nickel, pour pâte conductrice capable de former des pièces de câblage conductrices pour circuits électroniques ; et un procédé de fabrication de ladite poudre. En particulier, on utilise une poudre de cuivre revêtue de nickel caractérisée en ce qu~elle comprend une poudre de cuivre revêtue de nickel produite à l~aide d~une poudre de cuivre comme matériau de base, avec fixation d~un catalyseur de placage à la surface de poudre de cuivre par réaction de réduction et application de placage nickel auto-catalytique sur la surface la plus extérieure de celle-ci. La réaction par réduction est caractérisée en ce que l~hydrazine fait office d~agent réducteur.

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