Nickel electroplating process with reduced nickel ion build up

Details Nickel electroplating process with reduced nickel ion build up Nickel electroplating process with reduced nickel ion build up

C - Chemistry, Metallurgy

25

D

C25D 3/12 (2006.01)

Patent

CA 2053342

ABSTRACT OF THE DISCLOSURE A process for electrodepositing nickel on a conductive substrate in a manner which inhibits buildup of nickel ions in the electrolyte. A sacrificial anode and insoluble iron anode are immersed in a nickel electroplating bath. The current provided to the iron anode is controlled during plating to reduce the amount of nickel buildup on solution.

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