C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
149/15
C23F 1/28 (2006.01) H05K 3/06 (2006.01)
Patent
CA 1215301
ABSTRACT Process and solution for etching nickel and nickel alloys, particularly suitable for use in the manufacture of printed circuit boards. The nickel or alloy is contacted with an aqueous solution of nitric acid, nickel nitrate, a halogen additive and a surfactant. In some embodiments, a small amount of an amino acid is included in the solution to enhance the smoothness of the edges of the etched patterns.
490672
Psi Star
Smart & Biggar
LandOfFree
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