Nickel particle plating system

Details Nickel particle plating system Nickel particle plating system

C - Chemistry, Metallurgy

23

C

117/80, 117/46.1

C23C 18/38 (2006.01) B01J 13/00 (2006.01) B22F 1/02 (2006.01) C08K 7/18 (2006.01) C08K 9/02 (2006.01) H01B 1/02 (2006.01) H01B 1/16 (2006.01) H01B 1/22 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1303436

Abstract of the Disclosure A nickel particle plating system in which a multiplicity of minute nickel spheres are provided with a heavy copper coating and then a comparatively thin silver coating. The copper coating is at least about 20 percent by weight of the sphere, and the silver coating has a maximum thickness of about 15 percent of the sphere diameter. The coated spheres are deposited in a nonconductive matrix to form an electroconductive body in which the spheres may be placed along conductive paths.

597323

Affiliated with

Also associated with

Rating

Nickel particle plating system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Nickel particle plating system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nickel particle plating system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1319767