Nitrogen and sulfur compositions and acid copper plating baths

Details Nitrogen and sulfur compositions and acid copper plating baths Nitrogen and sulfur compositions and acid copper plating baths

C - Chemistry, Metallurgy

25

D

204/36, 260/467.

C25D 3/38 (2006.01) C07C 155/08 (1980.01)

Patent

CA 1104152

ABSTRACT OF THE DISCLOSURE Nitrogen and sulfur compositions are described which are useful in aqueous acidic plating baths and processes for electrodepositing bright and level copper coatings. The compositions are prepared by reacting a mixture of (a) a disulfide having the formula [RR'NCS2]2 (Formula I) wherein R and R' are each independently hydrogen, alkyl or aryl groups, and (b) a halo hydroxy sulfonic acid having the formula X(CH2)nCHOH-CH2SO3M (Formula II) wherein X is a halogen, n is one or two and M is hydrogen or an alkali metal, and (c) an aliphatic aldehyde containing up to three carbon atoms, in (d) an aqueous alkaline medium. Particularly bright and level deposits are obtained with these compositions containing an aliphatic aldehyde containing up to three carbon atoms. The presence of the above-described bright- ening and leveling agents in acid copper plating baths produces a lustrous, smooth and level deposit of copper over a wide range of current densities, particularly when wetting agents are included in the plating baths.

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