No thermal cure dry film solder mask

Details No thermal cure dry film solder mask No thermal cure dry film solder mask

G - Physics

03

C

400/2050, 96/253

G03C 1/72 (2006.01) C08F 265/02 (2006.01) C08G 18/62 (2006.01) C08G 18/81 (2006.01) G03F 7/033 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1291588

NO THERMAL CURE DRY FILM SOLDER MASK Abstract of Disclosure Disclosed are dry film solder mask compositions con- taining a binder material that is the reaction product of: (a) a polymerized mixture of polypropyleneglycol mono- methacrylate, methacrylic acid and, preferably, specific acrylates and methacrylates; and (b) isocyanatoethyl meth- acrylate. The masks are equal or superior to current dry film masks in affording protection to circuit boards.

515476

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