C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
400/5909
C08F 283/10 (2006.01) C08F 2/08 (2006.01) C08F 299/02 (2006.01) C08J 3/09 (2006.01)
Patent
CA 1250068
ABSTRACT Non-aqueous dispersions are disclosed which contain (A) an epoxy resin having an average epoxy equivalent weight of at least 475 and a Durran's softening point of at least 70°C, (B) a non-aqueous dispersion medium, and (C) a dispersant such as a copolymer of (1) at least one polymerizable ethyl- enically unsaturated monomer containing a group reactive with an epoxy group and (2) at least one polymerizable ethylenically unsaturated monomer free of any groups reactive with an epoxy group. These dispersions are useful in coatings, electrical or structural laminates or composites, body solders, adhesives, caulking compounds, casting com- pounds, filament winding and the like.
502605
Davis Rhetta Q.
Mizusawa Anita E.
Smart & Biggar
The Dow Chemical Company
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