Non-cfcs solder flux composition (1)

Details Non-cfcs solder flux composition (1) Non-cfcs solder flux composition (1)

B - Operations, Transporting

23

K

B23K 35/363 (2006.01) B23K 35/36 (2006.01)

Patent

CA 2215438

A blend mixture of non-toxic, non-corrosive liquid soldering flux consists essentially of a solution of hydrofluoric acid, formic acid, and fluoroaliphatic ammonium salts in iso-propanol. Neither precleaning nor postcleaning of the pieces being joined is necessary. The flux evaporates completely upon heating, leaving no corrosive residue or other product on the surface of the piece. The composition comprises about, a) 60-95% by weight iso-propanol, b) 1-10% by weight formic acid, c) 0.5-8% by hydrofluoric acid, and d) 0-10% by weight fluoroaliphatic ammonium salts.

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