Non-contact sensing and controlling of spacing between a...

Details Non-contact sensing and controlling of spacing between a... Non-contact sensing and controlling of spacing between a...

B - Operations, Transporting

23

Q

342/22.1

B23Q 15/24 (2006.01) B05C 11/10 (2006.01)

Patent

CA 1296083

ABSTRACT OF THE DISCLOSURE Dots of adhesive are deposited at selected locations of the surface of a printed circuit board by sensing a reference spacing between an adhesive dispensing nozzle tip advancing toward the substrate and each selected location on the substrate. The advance of the tip is halted at a preferred distance from each selected location. The tip of a vacuum spindle of a pick and place machine is spaced for handling surface mountable device components.

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