Non-metallic, integrated sensor-interconnect device,...

Details Non-metallic, integrated sensor-interconnect device,... Non-metallic, integrated sensor-interconnect device,...

G - Physics

01

D

G01D 11/00 (2006.01) A61B 5/00 (2006.01) G01D 3/028 (2006.01) G01D 5/00 (2006.01)

Patent

CA 2695860

Exemplary embodiments provide materials, devices and arrays of integrated sensor assembly, as well as methods for forming and using such devices and arrays in sensing systems. In one embodiment, the integrated sensor assembly can include an interconnecting member and at least one sensor member connected with the interconnecting member at any location thereof. Each of the sensor member and the interconnecting member can include a core element and a polymer. The core element for the sensor member and the core element for the interconnecting member can be electrically interconnected. Various embodiments can also include a connector member connected to the interconnecting member for transmitting sensing signals from or to the sensor member.

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