Non-planar circuit board and a method for fabricating the same

Details Non-planar circuit board and a method for fabricating the same Non-planar circuit board and a method for fabricating the same

H - Electricity

05

K

H05K 3/00 (2006.01)

Patent

CA 2682600

A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dimensional contoured surface (300). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate (112) is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.

La présente invention se rapporte à un procédé de fabrication d'une carte de circuit imprimé. Le procédé comprend la formation d'un substrat de carte de circuit imprimé (112) à partir d'un matériau pour fabriquer des cartes de circuit imprimé. Le procédé comprend par ailleurs le placement du substrat de carte de circuit imprimé sur une structure rigide (114) ayant une surface profilée à trois dimensions (300). Le procédé comprend en outre l'application de chaleur et l'application de pression sur le substrat de carte de circuit imprimé de façon à adapter au moins partiellement le substrat de carte de circuit imprimé à la surface profilée à trois dimensions. Si le substrat de carte de circuit imprimé (112) est un substrat de carte de circuit imprimé laminé, un schéma de circuit est alors formé sur le substrat de carte de circuit imprimé avant que les étapes d'application de chaleur et d'application de pression ne soient exécutées. Cependant, si le substrat de carte de circuit imprimé (112) est un substrat de carte de circuit imprimé non laminé, un schéma de circuit est alors formé sur le substrat de carte de circuit imprimé après que les étapes d'application de chaleur et d'application de pression ont été exécutées.

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