Noncontact dynamic tester for integrated circuits

Details Noncontact dynamic tester for integrated circuits Noncontact dynamic tester for integrated circuits

G - Physics

01

R

356/118

G01R 31/28 (2006.01) G01R 31/308 (2006.01)

Patent

CA 1220559

ABSTRACT OF THE DISCLOSURE NONCONTACT DYNAMIC TESTER FOR INTEGRATED CIRCUITS Testing of integrated circuit process intermediates, such as warers, dice or chips in various stages of production (test chips) is facilitated by a nonintrusive, noncontact dynamic testing technique, using a pulsed laser, with laser light modification to increase photon energy through conversion to shorter wavelength. The high energy laser light excites electron emissions to pass to the detection system as a com- posite function of applied light energy and of dynamic opera- tion of the circuit; detecting those emissions by an adjacent detector requires no ohmic contacts or special circuitry on the integrated circuit chip or wafer. Photoelectron energy emitted from a test pad on the test chip is detected as a composite function of the instantaneous input voltage as processed on the test chip, in dynamic operation including improper operation due to fault. The pulse from the laser, as modified through light modification, the parameters of de- tection of bias voltages, and the distances involved in chip- grid-detector juxtaposition, provides emissions for detection of circuit voltages occurring on the test chip under dynamic conditions simulating actual or stressed operation, with high time resolution of the voltages and their changes on the cir- cuit. Y0984-020

482173

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